Wire Bonding pcb ENEPIG surface finished high quality PCB production
1. The series of wire bonding technology are semiconductor wire bonding , will bring the best result of [拓展关键词特点] for you.
2. The product features good flexibility. It adopts high-quality aluminum alloy material, which is not easy to break down in the face of certain external force such as strong wind.
3. It has good chemical stability. It is not prone to have a reaction with light, heat, acid, alkali, and organic solvents.
4. Due to its remarkable characteristics, the product is increasingly used in the market.
5. The product is favored by a large number of people, showing the broad market application prospect of the product.
methods
Common PCB plating and wire bonding methods include
◪ Aluminum Wedge Wire Bonding and ENIG Plating
◪ Gold Ball Wire Bonding and soft gold plating
◪ Gold Ball Wire Bonding with ENEPEG plating
Wire bonding capabilities
Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:
Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.
Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.
Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.
Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.
Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.
COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.
Product application
Company Features
1. Rocket PCB Solution Ltd. integrates scientific research, manufacturing and distribution of wire bonding technology .
2. The factory has comprehensive one-stop production facilities. Those facilities are all certified under the specific quality system. This enables the factory to manufacture high quality and uniform products.
3. semiconductor wire bonding has long been a business tenet of Rocket PCB Solution Ltd.. Please contact us! Rocket PCB Solution Ltd. ensure ic wire bonding service for its costumers. Please contact us! aluminum wire bonding process is the central tenet of all our members. Please contact us! Focusing on building a future-oriented wire bonding is our aim. Please contact us!