wholesale wire bonding pcb bonding surface finished for digital device
- With a comprehensive management service system, Rocket PCB is capable of providing customers with one-stop and professional services.
1. Rocket PCB simple pcb board is well manufactured. Every process such as chip producing, bulb manufacturing, and lampshade surface treatment are paid close attention.
2. The product is waterproof. The polyester material has almost zero water absorption and the water cannot come into contact with the inner canopy.
3. The product has an anti-fatigue effect. When it is subjected to repeated loads, its structure will not easily get fractured.
4. Rocket PCB Solution Ltd. conducts strict quality testing from materials.
5. Rocket PCB Solution Ltd. has the determination to provide quality services to its customers.
methods
Common PCB plating and wire bonding methods include
◪ Aluminum Wedge Wire Bonding and ENIG Plating
◪ Gold Ball Wire Bonding and soft gold plating
◪ Gold Ball Wire Bonding with ENEPEG plating
Wire bonding capabilities
Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:
Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.
Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.
Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.
Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.
Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.
COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.
Product application
Company Features
1. Rocket PCB Solution Ltd. is good at making wire bonding pcb , whose product quality is proven by time.
2. In accordance with the requirements of ISO quality management system, the factory has established a complete set of procedures to control product quality so as to offer clients quality assurance.
3. We work towards achieving cost savings at various stages such as purchasing raw materials, shortening lead time, and reducing manufacturing expenses through waste reduction. Contact! We embrace social responsibility in our products, the way we conduct our business, and in our relations with customers, employees, vendors, shareholders, and communities. In every production process of simple pcb board, we always maintain a professional attitude. Contact! In view of the growing depletion of vital resources and the rising burdens on our ecosystem, we constantly seek new solutions to minimize the ecological impact of our products and processes during manufacture.