top brand wire bonding fabrication wire for digital device
1. Rocket PCB must be tested with regard to different aspects, including flammability testing, moisture resistance testing, antibacterial testing, and stability testing. The product allows the installation and repair process to be convenient
2. Rocket PCB Solution Ltd. has strong wire bonding market competitiveness and always hold strong sense of crisis in the enterprise. It is specifically designed to lessen the chances of shorts and wiring issues
3. The production practice shows that wire bonding is warmly welcome by because of . Its assembly process is conducted by a computer, leaving very little room for error
methods
Common PCB plating and wire bonding methods include
◪ Aluminum Wedge Wire Bonding and ENIG Plating
◪ Gold Ball Wire Bonding and soft gold plating
◪ Gold Ball Wire Bonding with ENEPEG plating
Wire bonding capabilities
Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:
Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.
Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.
Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.
Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.
Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.
COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.
Product application
Company Features
1. Rocket PCB Solution Ltd. has been engaged in manufacture and sales of Rocket PCB Solution Ltd. since the day of its establishment. Our business scope covers numbers of countries in the five major continents. Marketing channels such as direct marketing, advertising, sales promotion, and public relations make our products known worldwide.
2. We utilize the latest state-of-the-art production facilities which have been fully customized to meet our specification based on our know-how. This allows us to improve our production efficiency.
3. One of the keys to our success is that we have built engaged support teams. The teams care about how customers feel. They maintain an excellent rate of good service and occasionally conducting surveys to find out what and where they need to improve. Rocket PCB Solution Ltd. will provide one-stop solution for our wire bonding to help customers. Get an offer!