top brand printed circuit board industry gold surface finished for digital device
1. Rocket PCB printed circuit board industry has to go through the physical testing to evaluate its performance, comfort, safety and quality characteristics (slip resistance, abrasion, breathability, flexion, heel impact, etc.). Its compact design takes less space in a piece of application equipment
2. This product is worldwide renowned for its huge economic results. It offers a simple platform to arrange the electronic components in a compressed way
3. The product has a low self-discharge rate. It can retain the stored energy best and can be kept in storage for several years. Its components are always soldered in, which contributes to durability
4. This product is able to withstand numerous times of cleaning and washing. The dye-fixing agent is added into its material to protect the color from fading. The product brings reliability in the performance of the circuit
methods
Common PCB plating and wire bonding methods include
◪ Aluminum Wedge Wire Bonding and ENIG Plating
◪ Gold Ball Wire Bonding and soft gold plating
◪ Gold Ball Wire Bonding with ENEPEG plating
Wire bonding capabilities
Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:
Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.
Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.
Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.
Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.
Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.
COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.
Product application
Company Features
1. Through Rocket PCB , our customer service team always reveal a sincere and honest attitude towards our customers.
2. Under the management principle of printed circuit board industry , Rocket PCB is run strictly well. Get more info!