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thermal metal base pcb ceramic material conductivity for base material 1
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thermal metal base pcb ceramic material conductivity for base material 1
thermal metal base pcb ceramic material conductivity for base material 2
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thermal metal base pcb ceramic material conductivity for base material

Name:
Ceramic Substrate
Material:
Ceramic
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term::
DDU, FOB, CFA, CIF, CPT, EXW
Inquiry
Company Advantages
1. is core competitiveness of metal base pcb in its design. It reduces the component welding points and is possible in the reduction of the failure rate
2. This product has a very high price/performance ratio and is more easily accepted by customers. It is properly laid out, giving less electronics noise
3. The product itself is a perfect embodiment of quality in Rocket PCB. It is specifically designed to lessen the chances of shorts and wiring issues
4. The product is up to the international quality standards thanks to the implementation of the strict quality management system. It is hard to find any short circuits in this product
5. Its quality is effectively controlled with the help of our advanced production equipment. Its compact design takes less space in a piece of application equipment


Rocket PCB is good at aluminium oxide ceramic-based CCL PCB, alumina ceramic PCB, LED ceramic PCB, Al2O3 ceramic PCB, high thermal conduction ceramic PCB, ceramic-based PCB fabrication.

The ceramic PCB relies on ceramics as a matrix material and fabricates electronic parts of metal circuits thereon. It's an indispensable basic material for power module packaging in the electronic field. Ceramic substrates refer to the special method of copper foil bonding on to the surface of alumina (AL2Q3) or Al nitride (AlN) ceramic substrates (single or double sides) at high temperature. The ultra-thin composite substrate has wonderful electrical insulation, high thermal conductivity, wonderful solderability and high adhesion strength. It will etch numerous patterns like PCB board and has nice current carrying capability. Therefore, the ceramic substrate has become the fundamental material of high-powered electronic circuit structure technology and is that the most suitable option for high-powered LED, power devices, microwave devices, automotive electronics, high-frequency devices, solar cell modules and alternative applications.


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Product FEATURES


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Ceramics are superior to other printed circuit boards

  ◪   Higher operating temperatures up to 350℃

  ◪   Low expansion coefficient

  ◪   Good thermal performance

  ◪   Superior high-frequency performance

  ◪   Reduce costs for testing, insertion and assembly

  ◪   Smaller package size

  ◪   Sealed packaging with a water absorption rate of 0%



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. Rocket PCB Solution Ltd. supplies metal base pcb for adding values for customers.
2. Our company has excellent management. They have experience and knowledge in a wide range of areas related to manufacturing such as manufacturing processes and manufacturing efficiency. They can help the company achieve efficient production.
3. Considering each challenge to be a precious opportunity has been always the drive for Rocket PCB. Check it!
Contact us
we welcome custom designs and ideas and is able to cater to the specific requirements. for more information, please visit the website or contact us directly with questions or inquiries.
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