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thermal metal base pcb board material conductivity for electronics 1
thermal metal base pcb board material conductivity for electronics 2
thermal metal base pcb board material conductivity for electronics 1
thermal metal base pcb board material conductivity for electronics 2

thermal metal base pcb board material conductivity for electronics

Name:
Ceramic Substrate
Material:
Ceramic
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term::
DDU, FOB, CFA, CIF, CPT, EXW
Inquiry
Company Advantages
1. Rocket PCB is designed by the designing department who aims to enlarge the heat radiating area by designing it into a groove shape. In this way, the heat transfer area is largened. It is the perfect choice for manufacturers of electronic components, instruments, and equipment
2. This product can be used effectively for various application purposes. Its parts are spaced evenly and traces are symmetric and uniform
3. Theproduct is known for good durability and having a longer functional life. Its assembly process is conducted by a computer, leaving very little room for error
4. It has been tested by the harsh international first-class inspection standards. The electronic components and their polarities on it are clearly labeled


Rocket PCB is good at process aluminium oxide ceramic-based copper clad laminate, alumina ceramic laminate, LED ceramic laminate, Al2O3 ceramic laminate, high thermal conduction ceramic PCB, ceramic-based CCL PCB

The ceramic-based board relies on ceramics as a matrix material and fabricates electronic parts of metal circuits thereon. it's an imperative basic material for module packaging in the electronic field. Ceramic substrates refer to the special method of copper foil bonding on to the surface of alumina (AL2Q3) or Al nitride (AlN) ceramic substrates (single or double sides) at high temperature. The ultra-thin composite substrate has wonderful electrical insulation, high thermal conduction, wonderful solderability and high adhesion strength. It will etch numerous patterns like PCB board and has nice current carrying capability. Therefore, the ceramic substrate has become the fundamental material of high-powered electronic circuit structure technology and is that the most suitable option for high-powered LED, power devices, microwave devices, automotive electronics, high-frequency devices, solar cell modules and alternative applications.




Product FEATURES


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Ceramics are superior to other printed circuit boards


  ◪   Strong mechanical stress, stable shape; high strength, high thermal conductivity, high insulation; strong bonding force, anti-corrosion

  ◪   Excellent thermal cycle performance, 50,000 cycles, high reliability

  ◪   Like PCB board structure (or IMS substrate) which can etch various graphics, it is pollution-free

  ◪   The temperature range is - 55 C to 850 C, and the thermal expansion coefficient is close to silicon, which simplifies the production process of power module






Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. Rocket PCB Solution Ltd. is always committed to the manufacturing of high quality metal base pcb .
2. Rocket PCB Solution Ltd. has advanced facilities.
3. Reliability and integrity are the cornerstones of Rocket PCB 's strong relationships with our partners. Get price!
Contact us
we welcome custom designs and ideas and is able to cater to the specific requirements. for more information, please visit the website or contact us directly with questions or inquiries.
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