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stacked pcb manufacturing process hot-sale precision at discount 1
stacked pcb manufacturing process hot-sale precision at discount 2
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stacked pcb manufacturing process hot-sale precision at discount 4
stacked pcb manufacturing process hot-sale precision at discount 1
stacked pcb manufacturing process hot-sale precision at discount 2
stacked pcb manufacturing process hot-sale precision at discount 3
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stacked pcb manufacturing process hot-sale precision at discount

Name:
10 layer ELIC printed circuit board, any layer PCB fabrication
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term::
DDU, FOB, CFA, CIF, CPT, EXW
Inquiry
Company Advantages
1. Rocket PCB HDI PCB fabrication has passed a wide range of tests. It has been tested in terms of resistance to water penetration, fuel oil, fat, hot contact, discoloration, color transfer, and cracking. It is specifically designed to lessen the chances of shorts and wiring issues
2. Rocket PCB has acquired the certifications of pcb manufacturing process, and provides one-stop solution with quality inspection. It reduces the need for interconnecting wiring
3. pcb manufacturing process has many advantages, such as HDI PCB fabrication. The product brings reliability in the performance of the circuit


Anylayer/ ELIC (Every layer interconnection)


In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH)  is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.



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Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

......


ROCKET PCB Any Layer PCB (ELIC)process flow




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Anylayer PCB DFM suggestion for layout


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Product FEATURES


stacked pcb manufacturing process hot-sale precision at discount 10

  ◪   Any Layer PCBs with laser vias and filled plating on each layer

  ◪   0.4mm thin spacing CSP supported by Any layer interconnection

  ◪   Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices

ROCKET PCB STRENGTH

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SPECIALIZED MANUFACTURING


  • Conductive materials and core-to-core bonding

  • Embedded components

  • RF connector attachment

  • Laser direct imaging (LDI)

  • Laser etching

  • Laser forming

  • Multi-level cavity construction

  • Plated cavities and edges

  • Composite/hybrid Structures

  • N+N dual press-fit

  • Dual-drill

  • Bonding on metal core

  • Bulid-up HDI

  • Long-short and staged gold finger

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF contro

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CAPABILITIES


  • 3mil line and space

  • 4mil laser defined vias

  • 6mil chip-on-board

  • 6mil mechanically drilled vias

  • Conductive and non-conductive via fill

  • Dual backdrilling

  • Sequential lamination

  • Mixed dielectric

  • Heatsink Bonding

  • Heavy copper/thermal vias

  • Blind/buried vias

  • Stacked and staggerd microvias





stacked pcb manufacturing process hot-sale precision at discount 13

EXTENSIVE ANALYTICAL TESTING


  • Design Rules Check(DRC)

  • Electrical Testing

  • Automated Optical Inspection(AOI)

  • X-Ray

  • Plating thickness testing

  • Metalized vias inspection

  • Thermal shock testing

  • Surface peelability testing

  • Impedance control testing

  • 100% visual inspection

  • Solderability testing

  • Ionic cleanliness testing

  • Metallographic microscopic analysis

  • High voltage testing

  • Insulating resistance testing



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FEATURES


  • PTFE

  • High speed/low loss

  • High temperature

  • Low CTE

  • Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger

  • Combination surface finished

  • Copper-filled microvias







Product application


stacked pcb manufacturing process hot-sale precision at discount 15                
Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
stacked pcb manufacturing process hot-sale precision at discount 20                
IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. With years of concentration on the design and production of HDI PCB fabrication, Rocket PCB Solution Ltd. has been considered as one of the most trustworthy manufacturers.
2. Rocket PCB Solution Ltd. has a professional level and mature technology to participate in the production of high quality products.
3. We insist on sustainability. To promote safe, secure and sustainable living and working environments, we always apply science-based safety manufacturing.
Contact us
we welcome custom designs and ideas and is able to cater to the specific requirements. for more information, please visit the website or contact us directly with questions or inquiries.
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