Product Comparison
Rocket PCB insists on the use of high-quality materials and advanced technology to manufacture
PCB maker. Besides, we strictly monitor and control the quality and cost in each production process. All this guarantees the product to have high quality and favorable price.Rocket PCB's PCB maker is produced in strict accordance with standards. We make ensure that the products have more advantages over similar products in the following aspects.
Company Advantages1. The whole production of Rocket PCB HDI
PCB fabrication is handled by our professional production team using the advanced technology and equipment.
2. The product is valued for their features like durability, long-lasting functionality, and long service life.
3. Rocket PCB Solution Ltd.'s product performance is stable, price is reasonable and after-sales service good. .
4. Rocket PCB Solution Ltd. has been prospering for its considerate service for customers.
Anylayer/ ELIC (Every layer interconnection)
In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.
The interconnection structure of via hole (IVH) is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.
![stacked pcb manufacturing process free sample fabrication 7]()
Advantages
Improving high Density Wiring of Products
Reduce the weight of PCB substrate: about 60%
Reduce the size of manufactured handsets: about 30%
......
ROCKET PCB Any Layer PCB (ELIC)process flow
![stacked pcb manufacturing process free sample fabrication 9]()
Anylayer PCB DFM suggestion for layout
![stacked pcb manufacturing process free sample fabrication 10]()
![stacked pcb manufacturing process free sample fabrication 11]()
Product FEATURES
◪ Any Layer PCBs with laser vias and filled plating on each layer
◪ 0.4mm thin spacing CSP supported by Any layer interconnection
◪ Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices
ROCKET PCB STRENGTH
SPECIALIZED MANUFACTURING
Conductive materials and core-to-core bonding
Embedded components
RF connector attachment
Laser direct imaging (LDI)
Laser etching
Laser forming
Multi-level cavity construction
Plated cavities and edges
Composite/hybrid Structures
N+N dual press-fit
Dual-drill
Bonding on metal core
Bulid-up HDI
Long-short and staged gold finger
A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control
A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control
A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF contro
CAPABILITIES
3mil line and space
4mil laser defined vias
6mil chip-on-board
6mil mechanically drilled vias
Conductive and non-conductive via fill
Dual backdrilling
Sequential lamination
Mixed dielectric
Heatsink Bonding
Heavy copper/thermal vias
Blind/buried vias
Stacked and staggerd microvias
EXTENSIVE ANALYTICAL TESTING![]()
Design Rules Check(DRC)
Electrical Testing
Automated Optical Inspection(AOI)
X-Ray
Plating thickness testing
Metalized vias inspection
Thermal shock testing
Surface peelability testing
Impedance control testing
100% visual inspection
Solderability testing
Ionic cleanliness testing
Metallographic microscopic analysis
High voltage testing
Insulating resistance testing
FEATURES
PTFE
High speed/low loss
High temperature
Low CTE
Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger
Combination surface finished
Copper-filled microvias
Product application
Consumer electronics
Automotive electronics
Communications
Energy
Industrial & Instrumentation
IOT/Smart Home
Medical electronics
Security Industry
Company Features1. Rocket PCB is an economic entity which is professional in the production of
pcb manufacturing process.
2. Quality is above everything in Rocket PCB Solution Ltd..
3. Rocket PCB Solution Ltd. always walks on the road to excellence in thew field of
any-layer pcb . Contact us! Customer trust is the driving force for excellence in Rocket PCB Solution Ltd.. Contact us! Rocket PCB Solution Ltd. can provide the best choice according to your needs. Contact us!