Company Advantages1. The production of Rocket PCB consists of two parts, making processing such as extrusion, die casting, and stamping, as well as the deep process such as drilling, milling, and welding. It takes less time in assembling a circuit as compared to the conventional method
2. The product keeps the devices from the damage caused by over high temperature or overheats, hence, it extends the service life of the device. Its compact design takes less space in a piece of application equipment
3. With the advantages of ,
any-layer pcb is thought to be an optimal . It reduces the component welding points and is possible in the reduction of the failure rate
4. After comparison with other products, such conclusion can be made that any-layer pcb is superior with . The product is widely applied in consumer electronics
5. Owing to , Rocket PCB has gained much more popularity than before. The product reduces the possibility of loose connections or short circuit
Anylayer/ ELIC (Every layer interconnection)
In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.
The interconnection structure of via hole (IVH) is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.
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Advantages
Improving high Density Wiring of Products
Reduce the weight of PCB substrate: about 60%
Reduce the size of manufactured handsets: about 30%
......
ROCKET PCB Any Layer PCB （ELIC）process flow
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Anylayer PCB DFM suggestion for layout
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Product FEATURES
◪ Any Layer PCBs with laser vias and filled plating on each layer
◪ 0.4mm thin spacing CSP supported by Any layer interconnection
◪ Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices
ROCKET PCB STRENGTH
SPECIALIZED MANUFACTURING
Conductive materials and core-to-core bonding
Embedded components
RF connector attachment
Laser direct imaging (LDI)
Laser etching
Laser forming
Multi-level cavity construction
Plated cavities and edges
Composite/hybrid Structures
N+N dual press-fit
Dual-drill
Bonding on metal core
Bulid-up HDI
Long-short and staged gold finger
A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control
A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control
A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF contro
CAPABILITIES
3mil line and space
4mil laser defined vias
6mil chip-on-board
6mil mechanically drilled vias
Conductive and non-conductive via fill
Dual backdrilling
Sequential lamination
Mixed dielectric
Heatsink Bonding
Heavy copper/thermal vias
Blind/buried vias
Stacked and staggerd microvias
EXTENSIVE ANALYTICAL TESTING![]()
Design Rules Check(DRC)
Electrical Testing
Automated Optical Inspection(AOI)
X-Ray
Plating thickness testing
Metalized vias inspection
Thermal shock testing
Surface peelability testing
Impedance control testing
100% visual inspection
Solderability testing
Ionic cleanliness testing
Metallographic microscopic analysis
High voltage testing
Insulating resistance testing
FEATURES
PTFE
High speed/low loss
High temperature
Low CTE
Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger
Combination surface finished
Copper-filled microvias
Product application
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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry
With years of exploration, Rocket PCB Solution Ltd. has grown into a qualified manufacturer, specializing in design, manufacture, distribution of . Rocket PCB Solution Ltd. has superior equipment and advanced process for any-layer pcb production.
2. Produced by technology, our custom circuit board manufacturers are of high performance for its finest quality.
3. The entire production of double layer pcb meets up with and safety standard. We will comply with all applicable legal and regulatory requirements regarding environmental protection. We only discharge wastes or effluent that proven to be harmless by technology.
