Rocket PCB wire wire bonding pcb bulk fabrication for electronics
1. The tests for Rocket PCB wire bonding pcb cover different aspects. These tests are tear strength testing, electrical properties testing, cut resistance testing, and heat and fire protection testing.
2. The product has good quality and reliable performance.
3. The product has gained a good reputation in the industry, promoting its wider market application.
methods
Common PCB plating and wire bonding methods include
◪ Aluminum Wedge Wire Bonding and ENIG Plating
◪ Gold Ball Wire Bonding and soft gold plating
◪ Gold Ball Wire Bonding with ENEPEG plating
Wire bonding capabilities
Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:
Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.
Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.
Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.
Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.
Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.
COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.
Product application
Company Features
1. Rocket PCB Solution Ltd. is a professional manufacturer. We have many years' experience in designing and producing high-quality wire bonding pcb .
2. Rocket PCB Solution Ltd. has a strong technical base and manufacturing capabilities.
3. We always maintain professionalism in every production process wire bonding technology . Get price! We are committed to providing high-quality services and products. We meet the mutually agreed-to requirements the first time and strive for continuous improvement of our work processes. Get price! We embrace challenges, take risks, and don’t settle for achievements. Instead, we strive for more! We strive to progress in communication, management, and business. We cultivate differences by being original. Get price! Our core value is always treating customers with respect and faith. Ranging from all aspects of our business processes, we always adhere to integrity and business ethics. Get price!