Rocket PCB wholesale printed circuit board industry wire for electronics
1. Rocket PCB printed circuit board industry is made from high quality materials, which are sourced from reliable suppliers.
2. The strict quality control system is conducted to ensure the quality of the product.
3. printed circuit board industry,which could provide simple pcb board features, has prodigious superiority over other similar products.
4. Humanized exterior package for printed circuit board industry will be offered by us.
5. Rocket PCB Solution Ltd. takes responsibility for its actions and contributes to society.
methods
Common PCB plating and wire bonding methods include
◪ Aluminum Wedge Wire Bonding and ENIG Plating
◪ Gold Ball Wire Bonding and soft gold plating
◪ Gold Ball Wire Bonding with ENEPEG plating
Wire bonding capabilities
Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:
Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.
Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.
Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.
Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.
Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.
COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.
Product application
Company Features
1. In Rocket PCB Solution Ltd., its brand Rocket PCB is mainly famous for hot sell items including Wire Bonding PCB.
2. With strong R&D capability, Rocket PCB Solution Ltd. invests a large proportion of money and staff in printed circuit board industry's development.
3. We care about the community, the planet, and our future. We are committed to protecting our environment by executing strict production plans. We are putting every possible effort in reducing negative production impact on the earth. Our aim is heading Total Productive Maintenance (TPM) production approach. We endeavor to upgrade the production procedures to no breakdowns, no small stops or slow running, no defects, and no accidents.