Rocket PCB top brand wire bonding process wire for automotive
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1. wire bonding process 's structure has been developed using aluminum wire bonding process idea.
2. wire bonding process is widely polulor around the world.
3. The efforts of our team finally worked out to produce wire bonding process with aluminum wire bonding process .
4. Every product is a perfect embodiment of quality in Rocket PCB Solution Ltd..
5. Rocket PCB Solution Ltd. is well-funded, has advanced equipment and a group of highly skilled professionals.
methods
Common PCB plating and wire bonding methods include
◪ Aluminum Wedge Wire Bonding and ENIG Plating
◪ Gold Ball Wire Bonding and soft gold plating
◪ Gold Ball Wire Bonding with ENEPEG plating
Wire bonding capabilities
Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:
Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.
Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.
Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.
Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.
Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.
COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.
Product application
Company Features
1. The main business of Rocket PCB covers the manufacturing and sales service of wire bonding process .
2. We have been working with customers from different countries for many years, such as Europe and the United States. Now, we are expanding the marketing channels to cover more countries including Japan, Germany, and Korean.
3. Our service team in Rocket PCB Solution Ltd. is well-trained so as to provide satisfying service for customers. Contact us! aluminum wire bonding process is the management tenet from the first beginning. Contact us!