Application Scope
Rocket PCB's
PCB prototyping can be widely used in various fields.Rocket PCB is committed to producing quality
printed circuit board and providing comprehensive and reasonable solutions for customers.
Product Comparison
Rocket PCB insists on the use of high-quality materials and advanced technology to manufacture HDI PCB. Besides, we strictly monitor and control the quality and cost in each production process. All this guarantees the product to have high quality and favorable price.HDI PCB's outstanding advantages are as follows.
Company Advantages1. Rocket PCB dual layer pcb is of high quality and standard. Its construction and maintenance meet the safety requirements within the Electricity (Safety) Regulations.
2. Featured with high performance,
pcb manufacturing process has a high practical value.
3. The safety performance of the product far exceeds the average level in the market.
4. People can rest assured that it will not generate any radiation hazard and static which do harm to their health.
Anylayer/ ELIC (Every layer interconnection)
In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.
The interconnection structure of via hole (IVH) is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.
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Advantages
Improving high Density Wiring of Products
Reduce the weight of PCB substrate: about 60%
Reduce the size of manufactured handsets: about 30%
......
ROCKET PCB Any Layer PCB （ELIC）process flow
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Anylayer PCB DFM suggestion for layout
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Product FEATURES
◪ Any Layer PCBs with laser vias and filled plating on each layer
◪ 0.4mm thin spacing CSP supported by Any layer interconnection
◪ Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices
ROCKET PCB STRENGTH
SPECIALIZED MANUFACTURING
Conductive materials and core-to-core bonding
Embedded components
RF connector attachment
Laser direct imaging (LDI)
Laser etching
Laser forming
Multi-level cavity construction
Plated cavities and edges
Composite/hybrid Structures
N+N dual press-fit
Dual-drill
Bonding on metal core
Bulid-up HDI
Long-short and staged gold finger
A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control
A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control
A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF contro
CAPABILITIES
3mil line and space
4mil laser defined vias
6mil chip-on-board
6mil mechanically drilled vias
Conductive and non-conductive via fill
Dual backdrilling
Sequential lamination
Mixed dielectric
Heatsink Bonding
Heavy copper/thermal vias
Blind/buried vias
Stacked and staggerd microvias
EXTENSIVE ANALYTICAL TESTING![]()
Design Rules Check(DRC)
Electrical Testing
Automated Optical Inspection(AOI)
X-Ray
Plating thickness testing
Metalized vias inspection
Thermal shock testing
Surface peelability testing
Impedance control testing
100% visual inspection
Solderability testing
Ionic cleanliness testing
Metallographic microscopic analysis
High voltage testing
Insulating resistance testing
FEATURES
PTFE
High speed/low loss
High temperature
Low CTE
Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger
Combination surface finished
Copper-filled microvias
Product application
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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry
Rocket PCB has been specialized in producing pcb manufacturing process for years.
2. Over the years, we have been fortunate to attract some of the most talented professionals in our industry. They are dedicated to proving the very best service and response levels in the industry.
3. Professional after-sales service and the Rocket PCB branded double layer pcb will satisfy you. Check now! With the support of our professionals, Rocket PCB has enough confidence to make
any-layer pcb . Check now! Rocket PCB Solution Ltd. always improving our designs and models to acquire the world market. Check now!
