Application Scope
As one of Rocket PCB's main products,
PCB prototyping has wide applications. It is mainly used in the following aspects.Rocket PCB insists on providing customers with comprehensive solutions based on their actual needs, so as to help them achieve long-term success.
Product Details
In the production, Rocket PCB believes that detail determines result and quality creates brand. This is the reason that we strive for excellence in every product detail.Rocket PCB provides diversified choices for customers. HDI PCB is available in a wide range of types and styles, in good quality and in reasonable price.
Company Advantages1. Rocket PCB
any-layer pcb is produced in line with LED lighting production standards. These standards are up to both domestic and international standards such as GB and IEC, ensuring its high luminous efficiency.
2. any-layer pcb can serve dual layer pcb due to such advantages such as HDI
PCB fabrication.
3. With its performance being dual layer pcb , any-layer pcb is highly recommended by our costumers.
4. Since any-layer pcb 's put into market, it has received good comments from customers.
Anylayer/ ELIC (Every layer interconnection)
In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.
The interconnection structure of via hole (IVH) is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.
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Advantages
Improving high Density Wiring of Products
Reduce the weight of PCB substrate: about 60%
Reduce the size of manufactured handsets: about 30%
......
ROCKET PCB Any Layer PCB （ELIC）process flow
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Anylayer PCB DFM suggestion for layout
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Product FEATURES
◪ Any Layer PCBs with laser vias and filled plating on each layer
◪ 0.4mm thin spacing CSP supported by Any layer interconnection
◪ Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices
ROCKET PCB STRENGTH
SPECIALIZED MANUFACTURING
Conductive materials and core-to-core bonding
Embedded components
RF connector attachment
Laser direct imaging (LDI)
Laser etching
Laser forming
Multi-level cavity construction
Plated cavities and edges
Composite/hybrid Structures
N+N dual press-fit
Dual-drill
Bonding on metal core
Bulid-up HDI
Long-short and staged gold finger
A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control
A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control
A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF contro
CAPABILITIES
3mil line and space
4mil laser defined vias
6mil chip-on-board
6mil mechanically drilled vias
Conductive and non-conductive via fill
Dual backdrilling
Sequential lamination
Mixed dielectric
Heatsink Bonding
Heavy copper/thermal vias
Blind/buried vias
Stacked and staggerd microvias
EXTENSIVE ANALYTICAL TESTING![]()
Design Rules Check(DRC)
Electrical Testing
Automated Optical Inspection(AOI)
X-Ray
Plating thickness testing
Metalized vias inspection
Thermal shock testing
Surface peelability testing
Impedance control testing
100% visual inspection
Solderability testing
Ionic cleanliness testing
Metallographic microscopic analysis
High voltage testing
Insulating resistance testing
FEATURES
PTFE
High speed/low loss
High temperature
Low CTE
Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger
Combination surface finished
Copper-filled microvias
Product application
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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry
We have a professional team dedicated to providing and manufacturing high-quality dual layer pcb .
2. By applying HDI PCB fabrication technology for any-layer pcb , its quality is greatly improved.
3. Providing world-class products/services/processes and exceeding customer expectations is the promise and goal of Rocket PCB. Inquiry! Rocket PCB Solution Ltd. will step up efforts to open up overseas aftermarket and provide customers with the most cost-effective
pcb manufacturing process. Inquiry! Rocket PCB Solution Ltd. focuses on development and other mulch-functional integration and performance improvement of double layer pcb . Inquiry!
