Rocket PCB hot-sale wire bonding process surface finished for electronics
- Rocket PCB has established a complete service system to provide consumers with intimate after-sales services.
1. Rocket PCB simple pcb board is always ensured with good quality. Our factory guarantees a solid foundation for production and can minimize errors during processing.
2. The product is resistant to corrosion. It has passed rigorous oxidation treatment with a protective layer to resist any reaction with the air.
3. The product is available at very competitive prices and is widely used in the market.
4. The product has a variety of excellent properties and is increasingly used in various fields.
methods
Common PCB plating and wire bonding methods include
◪ Aluminum Wedge Wire Bonding and ENIG Plating
◪ Gold Ball Wire Bonding and soft gold plating
◪ Gold Ball Wire Bonding with ENEPEG plating
Wire bonding capabilities
Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:
Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.
Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.
Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.
Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.
Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.
COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.
Product application
Company Features
1. Rocket PCB Solution Ltd. is a reliable Chinese manufacturer of simple pcb board. Our experience, expertise, and professionalism remain unparalleled in the industry.
2. Rocket PCB Solution Ltd. pays high attention to the introduction of high-level production equipment to guarantee quality of wire bonding process .
3. We want to become even more a brand that people love - A future-proof and high-quality company with strong premium consumer and business relations. Our goal is to win more overseas market share in the coming few years. We will conduct foreign market research and identify international market conditions to better know market demands and make targeted plans.