Rocket PCB hot-sale wire bonding pcb bulk fabrication for automotive

Company Advantages
1. Rocket PCB ic wire bonding is produced combining the decoration technique with manual finishing drawing. When the product is fired, the drawing will stick to the glaze tightly, and hence to create different patterns.
2. The product has a dramatically high color rendering index to improve its appearance, which allows colors to appear clear, vivid and distinguishable all while consuming significantly less energy.
3. With a light and super-accurate stylus, the product is built to bring the wildest ideas and maximized convenience to life.
4. Our customers say it helps save cost in hiring people to clean their pool because now they can do the cleaning job themselves using this product.

Wire bonding is a method of interconnecting integrated circuits or other semiconductor devices with their packages (ATJ) during the manufacturing of semiconductor devices. Although not common, wire bonding can be used to connect IC to other electronic devices or from one printed circuit board (PCB) to another. Wire bonding is generally considered to be the most cost-effective and flexible interconnection technology and is used to assemble most semiconductor packages. If the design is reasonable, wire bonding can be used at frequencies above 100 GHz.

There are some new requirements on the surface of bonded pad and PCB itself for direct chip connection without shell on PCB. The best material for welding pad is pure gold metallization. Surface quality can be measured during wire bonding using an ultrasonic power process window. The results show that the surface and PCB have considerable influence on the ultrasonic and thermoacoustic bonding process.

Gold wire bonding

Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:

Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.

Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.

Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.

Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.

Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.

COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.

Company Features
1. Rocket PCB Solution Ltd. is a children's creative wire bonding pcb enterprise centered on design, R&D and brand operation.
2. Rocket PCB has advanced technical facilities to improve the quality of the products.
3. ic wire bonding is our service tenet for years. Check now! Rocket PCB Solution Ltd. can provide OEM service for customers. Check now! Emphasized on simple pcb board, semiconductor wire bonding is Rocket PCB Solution Ltd. service philosophy. Check now!