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Rocket PCB free sample double layer pcb mircovias for sale 1
Rocket PCB free sample double layer pcb mircovias for sale 2
Rocket PCB free sample double layer pcb mircovias for sale 3
Rocket PCB free sample double layer pcb mircovias for sale 4
Rocket PCB free sample double layer pcb mircovias for sale 1
Rocket PCB free sample double layer pcb mircovias for sale 2
Rocket PCB free sample double layer pcb mircovias for sale 3
Rocket PCB free sample double layer pcb mircovias for sale 4

Rocket PCB free sample double layer pcb mircovias for sale

Name:
10 layer ELIC printed circuit board, any layer PCB fabrication
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term::
DDU, FOB, CFA, CIF, CPT, EXW
Inquiry
Company Advantages
1. The design of double layer pcb gives customers feelings of dual layer pcb . Its components are always soldered in, which contributes to durability
2. This garment has an extra edge over other apparel. Sophisticated cutting, adhering to unique style, definitely adds to its charm. All the components within this product are fixed using solder flux
3. This product is safe. The chemical testing on heavy metals, VOC, formaldehyde, etc. helps to confirm all the raw materials comply with the safety regulations. The product reduces the possibility of loose connections or short circuit
4. This product is characterized by its ergonomic design. The forefoot part, arch part, and rear part are all designed with the respective functions to protect the feet. The product brings reliability in the performance of the circuit
5. The product features good sewing quality. The mature selvage workmanship makes the fabric tightly woven to prevent thread unraveling. It improves the wiring density and reduces the spacing of components


Anylayer/ ELIC (Every layer interconnection)


In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH)  is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.



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Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

......


ROCKET PCB Any Layer PCB (ELIC)process flow




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Anylayer PCB DFM suggestion for layout


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Product FEATURES


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  ◪   Any Layer PCBs with laser vias and filled plating on each layer

  ◪   0.4mm thin spacing CSP supported by Any layer interconnection

  ◪   Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices



The technology of making any layer HDI is summarized as follows


1) Precision alignment technology is one of the key technologies in making any-layer HDI board. In order to achieve precise inter-layer alignment effect, scientific and reasonable alignment target design and alignment mode are prerequisites.

2) All factors affecting the expansion, shrinkage and deformation of any layer HDI board need to be eliminated as far as possible. Precise inter-layer alignment effect of any layer HDI board will be affected by pre-placement of core board, plate selection, equipment difference and operation control.

3) Precision alignment technology is a control technology that runs through the whole process of making any- layer HDI board. It has very high requirements for equipment, materials, process parameters, personnel operation and production environment.

 

With the development of PCB towards light, thin, short, small and high reliability, the requirement of interlayer alignment accuracy for any layer HDI boards will bring more challenges and higher requirements for existing interlayer alignment control technology. In order to solve the problem of alignment accuracy of any layer HDI board, it is necessary to make a thorough study on it, make a comprehensive and detailed analysis from the technical principle to the actual operation, and find out the factors that affect the alignment accuracy to eliminate or decrease one by one. So that our inter-layer precise alignment technology is more mature, its control is more scientific, systematic and standardized, to meet the current production needs of higher-end PCB, to seize more market opportunities.



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. Rocket PCB Solution Ltd. is a professional and sizable company of double layer pcb . Rocket PCB Solution Ltd. has the first-class production equipment and good production environment.
2. With its stable product quality and its brand, Rocket PCB Solution Ltd. has established service networks nation-wide to serve consumers.
3. With the property of dual layer pcb , our produced any-layer pcb has gained much attention. We pursue an earth-friendly production model. We will execute strict production plans that significantly reduce negative production impact on the earth.
Contact us
we welcome custom designs and ideas and is able to cater to the specific requirements. for more information, please visit the website or contact us directly with questions or inquiries.
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