Rocket PCB finished wire bonding technology fabrication digital
1. Rocket PCB semiconductor wire bonding is designed in accordance with international standards, using high grade raw material.
2. The long-lasting and stable performance makes this product a great advantage in the industry.
3. Its prototype is continually tested against a wide variety of key performance criteria before going into production. It is also tested for conformity with a series of international standards.
4. We are striving hard to provide our clients maximum level of satisfaction with our wire bonding technology .
5. The new material has been developed in Rocket PCB Solution Ltd. to prepare wire bonding technology combining the excellent properties of semiconductor wire bonding .
methods
Common PCB plating and wire bonding methods include
◪ Aluminum Wedge Wire Bonding and ENIG Plating
◪ Gold Ball Wire Bonding and soft gold plating
◪ Gold Ball Wire Bonding with ENEPEG plating
Wire bonding capabilities
Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:
Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.
Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.
Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.
Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.
Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.
COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.
Product application
Company Features
1. Under strict quality control and professional management for wire bonding technology , Rocket PCB Solution Ltd. has grown to be internationally famous.
2. As a company with technical competitiveness, Rocket PCB Solution Ltd. has a number of printed circuit board industry production lines.
3. Enhancing the strength of producing wire bonding is the persistent goal of Rocket PCB. Get price! Rocket PCB Solution Ltd. will provide the market with high quality wire bonding pcb . Get price!