loading
Rocket PCB customized pcb manufacturing process precision 1
Rocket PCB customized pcb manufacturing process precision 2
Rocket PCB customized pcb manufacturing process precision 3
Rocket PCB customized pcb manufacturing process precision 4
Rocket PCB customized pcb manufacturing process precision 1
Rocket PCB customized pcb manufacturing process precision 2
Rocket PCB customized pcb manufacturing process precision 3
Rocket PCB customized pcb manufacturing process precision 4

Rocket PCB customized pcb manufacturing process precision

Name:
10 layer ELIC printed circuit board, any layer PCB fabrication
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term::
DDU, FOB, CFA, CIF, CPT, EXW
Inquiry
Application Scope
Rocket PCB's HDI PCB is widely used in the Manufacturing Electrical Equipment & Supplies PCB & PCBA industry.Rocket PCB insists on providing customers with reasonable solutions according to their actual needs.
  • Rocket PCB customized pcb manufacturing process precision 5
Enterprise Strength
  • Rocket PCB always puts customers and services in the first place. We constantly improve service while paying attention to product quality. Our goal is to provide high-quality products as well as thoughtful and professional services.
Company Advantages
1. Rocket PCB pcb prototyping fully complies with the relevant product safety Standard that governs it. It goes through a robust program of product testing, factory inspection, and on-going product surveillance to ensure safety.
2. The product features significant water absorption. It can absorb the amount of water under specified conditions such as temperatures and length of exposure.
3. This product is widely used by people from all walks of life.
4. The product is currently well-received in the market and is applied by more and more people.


Anylayer/ ELIC (Every layer interconnection)


In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH)  is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.



Rocket PCB customized pcb manufacturing process precision 6





Rocket PCB customized pcb manufacturing process precision 7
Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

......


ROCKET PCB Any Layer PCB (ELIC)process flow




Rocket PCB customized pcb manufacturing process precision 8



Anylayer PCB DFM suggestion for layout


Rocket PCB customized pcb manufacturing process precision 9

Rocket PCB customized pcb manufacturing process precision 10



Product FEATURES


Rocket PCB customized pcb manufacturing process precision 11

  ◪   Any Layer PCBs with laser vias and filled plating on each layer

  ◪   0.4mm thin spacing CSP supported by Any layer interconnection

  ◪   Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices

ROCKET PCB STRENGTH

Rocket PCB customized pcb manufacturing process precision 12


SPECIALIZED MANUFACTURING


  • Conductive materials and core-to-core bonding

  • Embedded components

  • RF connector attachment

  • Laser direct imaging (LDI)

  • Laser etching

  • Laser forming

  • Multi-level cavity construction

  • Plated cavities and edges

  • Composite/hybrid Structures

  • N+N dual press-fit

  • Dual-drill

  • Bonding on metal core

  • Bulid-up HDI

  • Long-short and staged gold finger

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF contro

Rocket PCB customized pcb manufacturing process precision 13


CAPABILITIES


  • 3mil line and space

  • 4mil laser defined vias

  • 6mil chip-on-board

  • 6mil mechanically drilled vias

  • Conductive and non-conductive via fill

  • Dual backdrilling

  • Sequential lamination

  • Mixed dielectric

  • Heatsink Bonding

  • Heavy copper/thermal vias

  • Blind/buried vias

  • Stacked and staggerd microvias





Rocket PCB customized pcb manufacturing process precision 14

EXTENSIVE ANALYTICAL TESTING


  • Design Rules Check(DRC)

  • Electrical Testing

  • Automated Optical Inspection(AOI)

  • X-Ray

  • Plating thickness testing

  • Metalized vias inspection

  • Thermal shock testing

  • Surface peelability testing

  • Impedance control testing

  • 100% visual inspection

  • Solderability testing

  • Ionic cleanliness testing

  • Metallographic microscopic analysis

  • High voltage testing

  • Insulating resistance testing



Rocket PCB customized pcb manufacturing process precision 15


FEATURES


  • PTFE

  • High speed/low loss

  • High temperature

  • Low CTE

  • Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger

  • Combination surface finished

  • Copper-filled microvias







Product application


Rocket PCB customized pcb manufacturing process precision 16                
Consumer electronics
Rocket PCB customized pcb manufacturing process precision 17                
Automotive electronics
Rocket PCB customized pcb manufacturing process precision 18                
Communications
Rocket PCB customized pcb manufacturing process precision 19                
Energy
Rocket PCB customized pcb manufacturing process precision 20                
Industrial & Instrumentation
Rocket PCB customized pcb manufacturing process precision 21                
IOT/Smart Home
Rocket PCB customized pcb manufacturing process precision 22                
Medical electronics
Rocket PCB customized pcb manufacturing process precision 23                
Security Industry

Company Features
1. For several decades, Rocket PCB Solution Ltd. has been engaged in the pcb manufacturing processindustry, and it has grown quickly.
2. Facing the future, Rocket PCB is committed to using the leading technology to offer the best any-layer pcb .
3. Rocket PCB Solution Ltd. will focus on the needs of each customer. Please contact. The vision and mission of our company are clear and concise. We have a plan to be a leading company in this industry within several years, and we hope our employees will help us achieve the goals and objectives through their contribution. Please contact. In the long run, Rocket PCB Solution will always create value for business partners. Please contact.
Contact us
we welcome custom designs and ideas and is able to cater to the specific requirements. for more information, please visit the website or contact us directly with questions or inquiries.
you might like
Copyright © 2026 Rocket PCB Solution Ltd. |Privacy Policy Sitemap
Customer service
detect