Product Comparison
Rocket PCB has great production capability and excellent technology. We also have comprehensive production and quality inspection equipment.
PCB prototyping has fine workmanship, high quality, reasonable price, good appearance, and great practicality.Compared with other same kind of products in the market, Rocket PCB's PCB prototyping is equipped with the following outstanding advantages.
Enterprise Strength
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Rocket PCB builds the brand by providing quality service. We improve service based on innovated service methods. We are committed to providing thoughtful services such as pre-sales consulting and after-sales service management.
Company Advantages1. pcb manufacturing process is characteristic and distinctive in style.
2. The service life of this product is highly guaranteed by the strict test procedure which is in line with international standard. It is tested to be high performance and user-friendly.
3. Rocket PCB Solution Ltd. has set up professional departments such as scientific research and development, production management, and sales services.
Anylayer/ ELIC (Every layer interconnection)
In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.
The interconnection structure of via hole (IVH) is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.
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Advantages
Improving high Density Wiring of Products
Reduce the weight of PCB substrate: about 60%
Reduce the size of manufactured handsets: about 30%
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ROCKET PCB Any Layer PCB （ELIC）process flow
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Anylayer PCB DFM suggestion for layout
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Product FEATURES
◪ Any Layer PCBs with laser vias and filled plating on each layer
◪ 0.4mm thin spacing CSP supported by Any layer interconnection
◪ Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices
ROCKET PCB STRENGTH
SPECIALIZED MANUFACTURING
Conductive materials and core-to-core bonding
Embedded components
RF connector attachment
Laser direct imaging (LDI)
Laser etching
Laser forming
Multi-level cavity construction
Plated cavities and edges
Composite/hybrid Structures
N+N dual press-fit
Dual-drill
Bonding on metal core
Bulid-up HDI
Long-short and staged gold finger
A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control
A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control
A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF contro
CAPABILITIES
3mil line and space
4mil laser defined vias
6mil chip-on-board
6mil mechanically drilled vias
Conductive and non-conductive via fill
Dual backdrilling
Sequential lamination
Mixed dielectric
Heatsink Bonding
Heavy copper/thermal vias
Blind/buried vias
Stacked and staggerd microvias
EXTENSIVE ANALYTICAL TESTING![]()
Design Rules Check(DRC)
Electrical Testing
Automated Optical Inspection(AOI)
X-Ray
Plating thickness testing
Metalized vias inspection
Thermal shock testing
Surface peelability testing
Impedance control testing
100% visual inspection
Solderability testing
Ionic cleanliness testing
Metallographic microscopic analysis
High voltage testing
Insulating resistance testing
FEATURES
PTFE
High speed/low loss
High temperature
Low CTE
Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger
Combination surface finished
Copper-filled microvias
Product application
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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry
Rocket PCB Solution Ltd. has evolved into one of the leading manufacturers and exporters in China. We are engaged in the production of pcb prototyping .
2. Our extensive partner and customer networks both at home and abroad help us better seize opportunities and achieve better business outcomes. We will continue to maintain friendly relationships with those clients and further explore more cooperative partners.
3. Consistently developing first-class pcb manufacturing process with our wisdom and power is our guiding policy. Inquire now! HDI
PCB fabrication has long been a tenet of Rocket PCB Solution Ltd.. Inquire now! Rocket PCB Solution Ltd., known as Rocket PCB, has been dedicating to producing and designing
any-layer pcb . Inquire now! dual layer pcb is the tenet that we've stuck to for years. Inquire now!
