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Rocket PCB customized double layer pcb layer 1
Rocket PCB customized double layer pcb layer 2
Rocket PCB customized double layer pcb layer 3
Rocket PCB customized double layer pcb layer 4
Rocket PCB customized double layer pcb layer 1
Rocket PCB customized double layer pcb layer 2
Rocket PCB customized double layer pcb layer 3
Rocket PCB customized double layer pcb layer 4

Rocket PCB customized double layer pcb layer

Name:
10 layer ELIC printed circuit board, any layer PCB fabrication
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term::
DDU, FOB, CFA, CIF, CPT, EXW
Inquiry
Company Advantages
1. Rocket PCB double layer pcb has been teste. It is in accordance with European norms in accredited testing institutions, including environmental and fire safety ones. It plays an important role in modern electronic equipment
2. Rocket PCB Solution Ltd. can help to identify clients' needs and circumstances. It improves the wiring density and reduces the spacing of components
3. This product provides structural stability. It is able to even out any stress on the building by dispersing kinetic force throughout the entire frame and structure. The product makes the process of replacing the particular failure components easier


Anylayer/ ELIC (Every layer interconnection)


In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH)  is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.



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Advantages

Improving high Density Wiring of Products

Reduce the weight of PCB substrate: about 60%

Reduce the size of manufactured handsets: about 30%

......


ROCKET PCB Any Layer PCB (ELIC)process flow




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Anylayer PCB DFM suggestion for layout


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Product FEATURES


Rocket PCB customized double layer pcb layer 10

  ◪   Any Layer PCBs with laser vias and filled plating on each layer

  ◪   0.4mm thin spacing CSP supported by Any layer interconnection

  ◪   Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices



The technology of making any layer HDI is summarized as follows


1) Precision alignment technology is one of the key technologies in making any-layer HDI board. In order to achieve precise inter-layer alignment effect, scientific and reasonable alignment target design and alignment mode are prerequisites.

2) All factors affecting the expansion, shrinkage and deformation of any layer HDI board need to be eliminated as far as possible. Precise inter-layer alignment effect of any layer HDI board will be affected by pre-placement of core board, plate selection, equipment difference and operation control.

3) Precision alignment technology is a control technology that runs through the whole process of making any- layer HDI board. It has very high requirements for equipment, materials, process parameters, personnel operation and production environment.

 

With the development of PCB towards light, thin, short, small and high reliability, the requirement of interlayer alignment accuracy for any layer HDI boards will bring more challenges and higher requirements for existing interlayer alignment control technology. In order to solve the problem of alignment accuracy of any layer HDI board, it is necessary to make a thorough study on it, make a comprehensive and detailed analysis from the technical principle to the actual operation, and find out the factors that affect the alignment accuracy to eliminate or decrease one by one. So that our inter-layer precise alignment technology is more mature, its control is more scientific, systematic and standardized, to meet the current production needs of higher-end PCB, to seize more market opportunities.



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. Rocket PCB Solution Ltd. is a quality supplier of double layer pcb . The scientific research and technological strength of Rocket PCB Solution Ltd. reaches the highest level of domestic and international technology.
2. Our factory uniquely owns a wide variety of state-of-the-art production facilities, which provides us with full control of the quality of our products throughout the entire process.
3. Rocket PCB Solution Ltd. has advanced manufacturing technology and performs strict production process. We stick to sustainable development. We guide our business partners to improve the social, ethical and environmental consequences of their products, services and supply chains.
Contact us
we welcome custom designs and ideas and is able to cater to the specific requirements. for more information, please visit the website or contact us directly with questions or inquiries.
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