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Professional Gold wire bonding pcb bonging pad PCB fabrication 1
Professional Gold wire bonding pcb bonging pad PCB fabrication 2
Professional Gold wire bonding pcb bonging pad PCB fabrication 1
Professional Gold wire bonding pcb bonging pad PCB fabrication 2

Professional Gold wire bonding pcb bonging pad PCB fabrication

5.0
Name:
Gold wire bonding PCB
Material:
gold wire,aluminum wire
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term::
DDU, FOB, CFA, CIF, CPT, EXW
design customization

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    methods

    product-Rocket PCB-Professional Gold wire bonding pcb bonging pad PCB fabrication-img

    Common PCB plating and wire bonding methods include


      ◪   Aluminum Wedge Wire Bonding and ENIG Plating

      ◪   Gold Ball Wire Bonding and soft gold plating

      ◪   Gold Ball Wire Bonding with ENEPEG plating

    Wire bonding capabilities


    Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:


    Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
    We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
    Multi-tier wire bonding up to 4 rows is available.


    Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
    Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.


    Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.


    Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.


    Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.


    COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.



    Product application


    product-Rocket PCB-img                
    Consumer electronics
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    Automotive electronics
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    Communications
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    Energy
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    Industrial & Instrumentation
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    IOT/Smart Home
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    Medical electronics
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    Security Industry
    Integrated PCB Services
    PCB Prototyping
     PCB Assembly Prototyping
     PCB Mass Production
     Turnkey PCB Assembly
     Special Process PCB Manufacturing Solutions
     Electronic Component Sourcing
     PCB Functional Testing
     One-Stop PCB Design Services
    Contact Rocket PCB
    High-End Chinese PCB manufacturing provider for your important order in any quantity!
    Please kindly complete the form on the right and we will contact you immediately. Or you can send your RFQs to our email
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