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packaging prototype circuit board integrated circuit for digital device 1
packaging prototype circuit board integrated circuit for digital device 2
packaging prototype circuit board integrated circuit for digital device 1
packaging prototype circuit board integrated circuit for digital device 2

packaging prototype circuit board integrated circuit for digital device

Name:
IC substrates
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Microvia Manufacturing, patterning and copper plating control, product reliability test technology
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term::
DDU, FOB, CFA, CIF, CPT, EXW
Inquiry
Company Advantages
1. Rocket PCB is manufactured under rigorous materials inspection procedure and standardized production conditions. The software program arranges its parts for best performance
2. People can consider this product as a smart investment because people can be sure that it will last for a long time with maximum beauty and comfort. It is properly laid out, giving less electronics noise
3. Featuring great pressure sensitivity, this product does not need much writing or drawing pressure to activate its identifying function. It improves the wiring density and reduces the spacing of components
4. The product is not prone to deformation. Its heel features strength, which is both fatigue and impact resistance to resist a crack or break. The product is widely applied in consumer electronics
5. The product is able to stand up high temperatures. The wood materials used will cope extremely well with the increased temperatures within the sauna room. Its signal paths are well organized and exposed quite well
About our product

IC substrates serve as the connection between IC chip(s) and the PCB through a conductive network of traces and holes. IC substrates are endowed with critical functions including circuit support and protection, heat dissipation, and signal and power distribution.
IC substrates represent the highest level of miniaturization in PCB manufacturing and share many similarities with semiconductor manufacturing. Rocket PCB produces many types of IC substrates on which IC chips are attached to the IC substrate utilizing wire bonding or flip chip methods.

packaging prototype circuit board integrated circuit for digital device 3

Advanced technology that Rocket PCB adopts for the IC substrates manufacturing includes:

  ◪   CSP (Chip Scale Packages)

  ◪   FC-CSP (Flip Chip) CSP

  ◪   COB (Chip on Board)

  ◪   PoP (Package on Package)

  ◪   COB (Chip on Board)

  ◪   PiP (Package in Package)

  ◪   SiP (System in Package)

  ◪   RF Module

  ◪   LED Package



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. Rocket PCB Solution Ltd. is a leading producer of in China. We have been producing and marketing the products continuously for many years both at home and abroad. All testing reports are available for our prototype circuit board .
2. We adopt world-advanced technology when manufacturing pcb industry .
3. The cutting-edge technology adopted in metal core pcb helps us win more and more customers. Our firm bears societal responsibilities. We Have obtained the Green Tag certificate demonstrating the lively and ecological performance of the systems.
Contact us
we welcome custom designs and ideas and is able to cater to the specific requirements. for more information, please visit the website or contact us directly with questions or inquiries.
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