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packaging pcb industry substrate for digital device 1
packaging pcb industry substrate for digital device 2
packaging pcb industry substrate for digital device 1
packaging pcb industry substrate for digital device 2

packaging pcb industry substrate for digital device

Name:
IC substrates
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Microvia Manufacturing, patterning and copper plating control, product reliability test technology
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term::
DDU, FOB, CFA, CIF, CPT, EXW
Inquiry
Product Details
Rocket PCB pays great attention to details of HDI PCB.Rocket PCB has great production capability and excellent technology. We also have comprehensive production and quality inspection equipment. HDI PCB has fine workmanship, high quality, reasonable price, good appearance, and great practicality.
  • packaging pcb industry substrate for digital device 3
Enterprise Strength
  • Based on customer demand, Rocket PCB is devoted to creating a convenient, high-quality, and professional service model.
Company Advantages
1. Rocket PCB finally worked out a beautiful design for our pcb industry.
2. The product has usability and long service life.
3. pcb industry has stable performance and long storage time.
4. Rocket PCB guarantees the quality of pcb industry.
About our product

IC substrates serve as the connection between IC chip(s) and the PCB through a conductive network of traces and holes. IC substrates are endowed with critical functions including circuit support and protection, heat dissipation, and signal and power distribution.
IC substrates represent the highest level of miniaturization in PCB manufacturing and share many similarities with semiconductor manufacturing. Rocket PCB produces many types of IC substrates on which IC chips are attached to the IC substrate utilizing wire bonding or flip chip methods.

packaging pcb industry substrate for digital device 4

Advanced technology that Rocket PCB adopts for the IC substrates manufacturing includes:

  ◪   CSP (Chip Scale Packages)

  ◪   FC-CSP (Flip Chip) CSP

  ◪   COB (Chip on Board)

  ◪   PoP (Package on Package)

  ◪   COB (Chip on Board)

  ◪   PiP (Package in Package)

  ◪   SiP (System in Package)

  ◪   RF Module

  ◪   LED Package



Product application


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Consumer electronics
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Automotive electronics
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Communications
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Energy
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Industrial & Instrumentation
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IOT/Smart Home
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Medical electronics
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Security Industry

Company Features
1. Rocket PCB Solution Ltd. is proud to be a pioneer manufacturer for pcb industry.
2. Our factory is located in a place that is near to the railroad, highway, and ports. This enables us to shorten the shipment distance and cut the load and unload times during transport links, which eventually helps cut transportation costs.
3. Rocket PCB Solution Ltd. is committed to building the world's first brand among comparable products! Call now! Our aim is 'Passion: committed in heart and mind.' We encourage employees to work harder to provide customers service whole-heartedly. Call now! Rocket PCB Solution will continue to enrich the product lines that consumers around the world would love. Present your needs, Rocket PCB Solution will meet your best needs. For us, the customer is god. Call now!
Contact us
we welcome custom designs and ideas and is able to cater to the specific requirements. for more information, please visit the website or contact us directly with questions or inquiries.
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