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integrated pcb industry packaging for sale Rocket PCB 1
integrated pcb industry packaging for sale Rocket PCB 2
integrated pcb industry packaging for sale Rocket PCB 1
integrated pcb industry packaging for sale Rocket PCB 2

integrated pcb industry packaging for sale Rocket PCB

Name:
IC substrates
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Microvia Manufacturing, patterning and copper plating control, product reliability test technology
Payment:
L/C,T/T,Western Union
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term::
DDU, FOB, CFA, CIF, CPT, EXW
Inquiry
Enterprise Strength
  • Rocket PCB wholeheartedly provides intimate and reasonable services for customers.
Company Advantages
1. Unique prototype circuit board contributes to the popularity of pcb industry.
2. The product is not subject to permanent deformation. It has good compressibility and resilience to guarantee that it will not deform due to high-intensitive mechanical movement.
3. It features water repellency. The coating on its fabric will result in water running off rather than being absorbed into the fabric.
4. The superior quality greatly help pcb industry gain good reputation in the industry.
5. Based on the company's leading production equipment and manufacturing technology, Rocket PCB Solution Ltd. provides customers with 'one-stop sourcing' solutions.
About our product

IC substrates serve as the connection between IC chip(s) and the PCB through a conductive network of traces and holes. IC substrates are endowed with critical functions including circuit support and protection, heat dissipation, and signal and power distribution.
IC substrates represent the highest level of miniaturization in PCB manufacturing and share many similarities with semiconductor manufacturing. Rocket PCB produces many types of IC substrates on which IC chips are attached to the IC substrate utilizing wire bonding or flip chip methods.

integrated pcb industry packaging for sale Rocket PCB 3

Advanced technology that Rocket PCB adopts for the IC substrates manufacturing includes:

  ◪   CSP (Chip Scale Packages)

  ◪   FC-CSP (Flip Chip) CSP

  ◪   COB (Chip on Board)

  ◪   PoP (Package on Package)

  ◪   COB (Chip on Board)

  ◪   PiP (Package in Package)

  ◪   SiP (System in Package)

  ◪   RF Module

  ◪   LED Package



Product application


integrated pcb industry packaging for sale Rocket PCB 4                
Consumer electronics
integrated pcb industry packaging for sale Rocket PCB 5                
Automotive electronics
integrated pcb industry packaging for sale Rocket PCB 6                
Communications
integrated pcb industry packaging for sale Rocket PCB 7                
Energy
integrated pcb industry packaging for sale Rocket PCB 8                
Industrial & Instrumentation
integrated pcb industry packaging for sale Rocket PCB 9                
IOT/Smart Home
integrated pcb industry packaging for sale Rocket PCB 10                
Medical electronics
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Security Industry

Company Features
1. Rocket PCB Solution Ltd., by virtue of its strong competence in R&D and manufacturing, is a successful and highly reputable prototype circuit board manufacturer.
2. The factory production lines of Rocket PCB Solution Ltd. are all run under the international standard.
3. At Rocket PCB Solution Ltd., pcb products always comes first. Inquire! Rocket PCB Solution Ltd. will be responsible for the supply of damaged parts during transportation. Inquire! Rocket PCB always insists on serving the customers as the main task. Inquire! With the goal of becoming an excellent pcb industry company, Rocket PCB strives to achieve the biggest value. Inquire!
Contact us
we welcome custom designs and ideas and is able to cater to the specific requirements. for more information, please visit the website or contact us directly with questions or inquiries.
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