Info Center
Rocket PCB News center where you can find news about PCB-related professional knowledge and industry information trends help you better understand the PCB industry and PCB manufacturing processes, PCB processes up to 30 steps, let alone special boards. Here, combined with our years of expertise, we will continue to update different types of PCB features and specifications and electronic related knowledge. If you are interested, I believe you will benefit a lot!
Inspection is a key step in all PCB production processes. It can detect PCB defects in order to correct them and improve overall performance.
2020
11
20
This article introduces in detail 7 common PCB surface treatment processes to help you compare and choose the appropriate surface treatment.
2020
11
18
The successful manufacture of HDI PCB requires special equipment and processes, such as laser drilling, hole filling and electroplating, laser direct imaging and sequential lamination cycle.
2020
11
12
The history of Rocket PCB has been shaped by high density interconnect (HDI) printed circuit boards. In 2002 they were developed for mass production for the nascent mobile phone industry. Since then HDI printed circuit boards have found applications throughout the electronics industry, and their use was given additional impetus by the introduction of BGA/CSP components. Rocket PCB offers the full range of technologies, from 4-layer laser to 6-n-6 HDI multilayer in all thicknesses.
2020
11
09
The most detailed illustration about PCB manufacturing process.
2020
11
04
PCB drilling is a very important process in PCB manufacturing process, it has three common drilling methods.
2020
10
30
HDI boards, one of the fastest growing technologies in PCBs. HDI Boards contain blind and/or buried vias and often contain microvias of .006 or less in diameter. They have a higher circuitry density than traditional circuit boards.
There are 6 different types of HDI boards, through vias from surface to surface, with buried vias and through vias, two or more HDI layer with through vias, passive substrate with no electrical connection, coreless construction using layer pairs and alternate constru
There are 6 different types of HDI boards, through vias from surface to surface, with buried vias and through vias, two or more HDI layer with through vias, passive substrate with no electrical connection, coreless construction using layer pairs and alternate constru
2020
10
27
PCB manufacturing has many applications, but we will introduce the 10 most common uses of printed circuit boards.
2020
10
15
In general, the cost of raw materials accounts for 60% of the cost of PCB, and its price fluctuation cost has a great impact on the overall development of the PCB industry. PCB raw materials are a plate that can not be ignored by enterprises in the industry.
2020
10
14
FPC, in fact, belongs to a kind of PCB, but it is quite different from the traditional printed circuit board.
2020
10
14
With more density came more power dissipation and thus more heat generation. So a usual FR-4 based substrate PCB was not capable to withstand such high temperatures and thermal characteristics of FR-4 was not up to mark, hence the researchers found the solution in the form of "Ceramic PCB".
2020
10
14
Lead-free PCBs (Printed Circuit Boards) were first called for just for the compliance of ROHS (Restriction Of Hazardous Substances) that requires all the electronics have to conform to ROHS regulations. As a result, PCB fabrication starts to convert from lead to lead-free.
2020
10
13
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