hot-sale wire bonding technology gold wire for automotive
1. The textile fibers of Rocket PCB ic wire bonding will be strictly checked before production. The fibers must be assessed in terms of strength, stretching force, gram weight, and hand feeling.
2. This product rejects odors and bacteria. Its surface contains an antimicrobial agent that inhibits the ability of microorganisms to grow.
3. This product features hypoallergenic. No harmful or skin irritant chemical agents have been used in its fabrics treatment procedure.
4. We are a leading enterprise which is dedicated to supplying all kinds of wire bonding technology and other medical equipment.
methods
Common PCB plating and wire bonding methods include
◪ Aluminum Wedge Wire Bonding and ENIG Plating
◪ Gold Ball Wire Bonding and soft gold plating
◪ Gold Ball Wire Bonding with ENEPEG plating
Wire bonding capabilities
Rocket PCB has a set of bonding equipment with unique functions. Our wide range of machines provides customers with the flexibility they need for a wide range of bonding applications. Rocket PCB offers a variety of wire bonding technologies. Our wire bonding capabilities include:
Ball Bonding——wire diameters ranging from 0.7 to 2.0 mils (18 microns to 50 microns).
We offer standard, fine pitch, and ultra-fine pitch bonding down to 35 microns.
Multi-tier wire bonding up to 4 rows is available.
Wedge Bonding——Wire diameters range from 1.0 to 2.0 mils (18 microns to 50 microns).
Aluminum wedge bonding is commonly used for Chip-on-Board (COB). By utilizing aluminum wire, the PCB can be manufactured with a plating method of lower cost and the PCB is usually applied to COB LED.
Heavy Wire Bonding—— Wire diameters range from 4.0 to 20.0 mils (102 microns to 508 microns). Heavy Wire is usually applied to power semiconductor devices and automotive industry.
Stud Bumping——Wire diameters range from 0.7 to 2.0 mils (18 microns to 50 microns). Stud Bumping is usually applied to the gold stud bumping prior to Flip chip attachment. Thermosonic flip Chip and thermocompression flip Chip undergo flip chip attachment process and are equipped with gold stud bumps. Epoxy attachment is also available.
Ribbon Bonding——The size of gold ribbons can be customized. Please contact Rocket PCB with your specific requirement.
COB Wire Bonding——Rocket has developed advanced gold or aluminum wire bonding for PCB manufacturing and we can offer advanced COB wire bonding technology.tions.
Product application
Company Features
1. Rocket PCB Solution Ltd. is a small and medium-sized wire bonding technology manufacturer with advanced equipment.
2. The technical key indicators of printed circuit board industry products have reached the international advanced level.
3. We strive to create sustainable value – for our customers and our consumers, for our teams and our people, for our shareholders as well as for the wider society and communities in which we operate. During the production processes, we consciously reduce pollution. We have introduced professional wastewater treating and waste recycling facilities to help us control waste discharge. We are acting responsibly during our operation. We work to reduce our demand for energy through conservation, improving the energy efficiency of equipment and processes. We are strongly committed to driving innovation and circularity. We encourage the use of sustainable materials in our products and promote responsible production practices.