High precision any layer HDI multilayer PCB fabrication

Company Advantages
1. Developed from industrial raw material the offered double layer pcb features clean appearance. Its assembly process is conducted by a computer, leaving very little room for error
2. With an annual sales for HDI PCB fabrication volume ranking first in the industry, Rocket PCB Solution Ltd.'s sales volume of self-owned brands ranks first in China's double layer pcb companies. Its signal paths are well organized and exposed quite well
3. The product conforms to the quality standards of various countries and has been approved to be of long-lasting performance and relatively long service life. It improves the wiring density and reduces the spacing of components
4. The products are internationally certified and have a longer service life than other products. The software program arranges its parts for best performance
5. The product has reliable and consistent quality thanks to the detailed quality inspection throughout the whole production. It makes the interconnections less bulky

Anylayer/ ELIC (Every layer interconnection)

In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

The interconnection structure of via hole (IVH)  is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.

ROCKET PCB Any Layer PCB （ELIC）process flow

Anylayer PCB DFM suggestion for layout

The technology of making any layer HDI is summarized as follows

1) Precision alignment technology is one of the key technologies in making any-layer HDI board. In order to achieve precise inter-layer alignment effect, scientific and reasonable alignment target design and alignment mode are prerequisites.

2) All factors affecting the expansion, shrinkage and deformation of any layer HDI board need to be eliminated as far as possible. Precise inter-layer alignment effect of any layer HDI board will be affected by pre-placement of core board, plate selection, equipment difference and operation control.

3) Precision alignment technology is a control technology that runs through the whole process of making any- layer HDI board. It has very high requirements for equipment, materials, process parameters, personnel operation and production environment.

 

With the development of PCB towards light, thin, short, small and high reliability, the requirement of interlayer alignment accuracy for any layer HDI boards will bring more challenges and higher requirements for existing interlayer alignment control technology. In order to solve the problem of alignment accuracy of any layer HDI board, it is necessary to make a thorough study on it, make a comprehensive and detailed analysis from the technical principle to the actual operation, and find out the factors that affect the alignment accuracy to eliminate or decrease one by one. So that our inter-layer precise alignment technology is more mature, its control is more scientific, systematic and standardized, to meet the current production needs of higher-end PCB, to seize more market opportunities.

Company Features
1. Rocket PCB Solution Ltd. is sophisticated in manufacture high quality double layer pcb products.
2. Over hundreds of skilled pcb manufacturing process technicians provide customers with the most sophisticated products.
3. Rocket PCB Solution Ltd. is committed to provide satisfactory services to the clients. Inquiry!