Embedded pcb resistor resistance buried manufacturing for Cable Assembly

Company Advantages
1. The production process of Rocket PCB prototype pcb assembly is well-controlled. From the extraction of raw materials to the mixture, forming, and cutting, every step is highly efficient. All the components within this product are fixed using solder flux
2. The product increases the efficiency of the everyday sales environment thanks to different POS features such as barcode scanners or credit card terminals. It reduces the need for interconnecting wiring
3. The product has been recognized with ISO 9001 certification. The electronic components and their polarities on it are clearly labeled
4. The quality of the product is fully assured by the implementation of the strict quality management system. The product is widely applied in consumer electronics

=

Passive and active chips can be embedded in PCB using two basic processes: face-down and face-down. The two variants differ in the way components are connected to the outside world and use different materials and processes. Figure 1 outlines these two approaches.

In the front process, the component is placed on the carrier material, and the contact pad of the component can be seen after assembly. This method provides some very good thermal performance and is very suitable for power module embedding. Processing constraints are encountered when trying to embed components with variable thickness. After embedding, the dielectric thickness between the component surface and the external copper surface remains unchanged, which poses a challenge to the subsequent micro-laser drilling and copper plating technology, especially in the case of via filling.

In the face-down process, the component and the component image are assembled together into the carrier material. Normally, screen-printed non-conductive adhesives are used as carriers for fixing components. This method has several advantages: good thickness control of dielectric materials between components and carriers, and good registration accuracy in assembly process. The reason for the improvement of alignment capability comes from the fact that the camera of the assembly machine can see the image of the component, so it can be aligned before the assembly is completed.

In frontal technology, the camera is aligned to the contour of the component.

Using face-down technology, several components of different thickness can be embedded into the FR-4 core. The prepreg used for embedding is removed to form a cavity around the assembly. Prepregs with openings are stacked to the height of the assembly and are provided with non-openings at the top. By opening the dielectrics to various heights of the components, usually ranging from 100 to 350 um, it is easy to achieve different thickness embedding. Then, the embedded kernel can be used as the standard inner core and included in the PCB multi-layer structure. External SMD components can then be assembled on both sides of an embedded PCB to form very high-density modules/components (see Figure 2).

Embedded capacitors have many advantages, such as saving surface space, improving the product rate of device assembly, reducing power supply noise, reducing electromagnetic interference, simplifying circuit board design, and also raising higher challenges to equipment processing technology.

Company Features
1. Rocket PCB Solution Ltd. has been dedicated to manufacturing embedded pcb since established.
2. We have a state-based team of experienced and fully trained sales representatives. They are able to provide customers with professional advice or product solutions.
3. Rocket PCB believes it is essential for Rocket PCB to implement the plan of being a modern pcb production supplier. Contact us!