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High multilayer anylayer HDI PCB stacked and stagged mircovias 1
High multilayer anylayer HDI PCB stacked and stagged mircovias 2
High multilayer anylayer HDI PCB stacked and stagged mircovias 1
High multilayer anylayer HDI PCB stacked and stagged mircovias 2

High multilayer anylayer HDI PCB stacked and stagged mircovias

5.0
Name:
10 layer ELIC printed circuit board, any layer PCB fabrication
Material:
FR4
Board thickness:
1.6mm
Surface treatment:
Immersion Gold
Technology:
Stack up N+N, Min Track/Width 3/3mil, Blind & Buried vias, laser vias
Payment:
L/C,T/T,WesternUnion
Certification:
UL Consumer (Wear, Electronic Digital, Household Appliances, Connectors)/Industrial Control/Automobile TS16949/Medical/Server, Cloud Computing & Base Station/Aviation/Military/Communication (Certification in Related Applications)
Delivery Term::
DDU, FOB, CFA, CIF, CPT, EXW
design customization

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    Anylayer/ ELIC (Every layer interconnection)


    In order to adapt to the development of CSP and inverted chip packaging (FC), it is necessary to use high density PCB with internal via hole (IVH) structure. In order to break through the limitation of traditional HDI high density interconnection laminates, it is necessary to import higher-order any layer interconnection technology so that any layer can be arbitrarily connected to another layer to form internal conduction.

    The interconnection structure of via hole (IVH)  is designed to be used in higher-level HDI products to achieve the purpose of light, thin, short and small.



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    Advantages

    Improving high Density Wiring of Products

    Reduce the weight of PCB substrate: about 60%

    Reduce the size of manufactured handsets: about 30%

    ......


    ROCKET PCB Any Layer PCB (ELIC)process flow




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    Anylayer PCB DFM suggestion for layout


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    product-High multilayer anylayer HDI PCB stacked and stagged mircovias-Rocket PCB-img



    Product FEATURES


    product-Rocket PCB-High multilayer anylayer HDI PCB stacked and stagged mircovias-img

      ◪   Any Layer PCBs with laser vias and filled plating on each layer

      ◪   0.4mm thin spacing CSP supported by Any layer interconnection

      ◪   Mass-production of 10-layer M-VIA Ⅲ (Any Layer PCB) for mobile devices

    ROCKET PCB STRENGTH

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    SPECIALIZED MANUFACTURING


    • Conductive materials and core-to-core bonding

    • Embedded components

    • RF connector attachment

    • Laser direct imaging (LDI)

    • Laser etching

    • Laser forming

    • Multi-level cavity construction

    • Plated cavities and edges

    • Composite/hybrid Structures

    • N+N dual press-fit

    • Dual-drill

    • Bonding on metal core

    • Bulid-up HDI

    • Long-short and staged gold finger

    A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

    A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF control

    A wide range of professional manufacturing solutions, can be used for thermal energy (CTE) structural coefficients, thermal challenge design and application, extreme and unique HDI structures, and RF contro

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    CAPABILITIES


    • 3mil line and space

    • 4mil laser defined vias

    • 6mil chip-on-board

    • 6mil mechanically drilled vias

    • Conductive and non-conductive via fill

    • Dual backdrilling

    • Sequential lamination

    • Mixed dielectric

    • Heatsink Bonding

    • Heavy copper/thermal vias

    • Blind/buried vias

    • Stacked and staggerd microvias





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    EXTENSIVE ANALYTICAL TESTINGproduct-Rocket PCB-img-1


    • Design Rules Check(DRC)

    • Electrical Testing

    • Automated Optical Inspection(AOI)

    • X-Ray

    • Plating thickness testing

    • Metalized vias inspection

    • Thermal shock testing

    • Surface peelability testing

    • Impedance control testing

    • 100% visual inspection

    • Solderability testing

    • Ionic cleanliness testing

    • Metallographic microscopic analysis

    • High voltage testing

    • Insulating resistance testing



    product-High multilayer anylayer HDI PCB stacked and stagged mircovias-Rocket PCB-img-1


    FEATURES


    • PTFE

    • High speed/low loss

    • High temperature

    • Low CTE

    • Lead-free, HASL, ENIG, EPENIG, Immersion Silver, Tin, Gold finger

    • Combination surface finished

    • Copper-filled microvias







    Product application


    product-Rocket PCB-High multilayer anylayer HDI PCB stacked and stagged mircovias-img-1                
    Consumer electronics
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    Automotive electronics
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    Communications
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    Energy
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    Industrial & Instrumentation
    product-High multilayer anylayer HDI PCB stacked and stagged mircovias-Rocket PCB-img-2                
    IOT/Smart Home
    product-Rocket PCB-High multilayer anylayer HDI PCB stacked and stagged mircovias-img-2                
    Medical electronics
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    Security Industry
    Integrated PCB Services
    PCB Prototyping
     PCB Assembly Prototyping
     PCB Mass Production
     Turnkey PCB Assembly
     Special Process PCB Manufacturing Solutions
     Electronic Component Sourcing
     PCB Functional Testing
     One-Stop PCB Design Services
    Contact Rocket PCB
    High-End Chinese PCB manufacturing provider for your important order in any quantity!
    Please kindly complete the form on the right and we will contact you immediately. Or you can send your RFQs to our email
    Contact Us
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