Embedded Coin + Inlay PCB
2019-03-06
Typical Index | Typical value |
Layers | 22L |
Size | 558.8mm×406.4mm |
Total Thickness | 0.110” |
A/R | 11:1 |
coin shape | T coin, I coin |
Min. Size of coin | 3*7mm |
Max. Size of coin | 27*27mm |
Min. hole size on coin | 0.5mm |
Flatness | Coin:+2mil/-1mil Inlay Material: ±mil |
Base Material | S1000H+RO4350B |
Thermal Reliability | LF reflow 5X, thermal stress 3X |
Application | Communication, PA, RF |
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